Infrared imaging probe

ABSTRACT

An infrared imaging probe that includes an elongated wand and an electrically isolating connection between the imaging components, located at the distal end of the wand, and the image processing components, located at the proximal end of the wand.

PRIORITY CLAIM

The present application is a divisional application of U.S. patentapplication Ser. No. 12/647,175, entitled INFRARED IMAGING PROBE andfiled Dec. 24, 2009, which claims priority to U.S. Provisional PatentApplication No. 61/140,912 entitled INFRARED IMAGING PROBE, and filedDec. 26, 2008, the disclosures of which are herein incorporated byreference in their entirety.

BACKGROUND

Infrared (IR) imaging devices can be used, for example, for the purposeof obtaining thermal images of an object by absorbing IR energyirradiated from the targeted object. From such images, the surfacetemperature distribution of the object can be obtained and analyzed. IRimaging devices require a line of sight to deliver a suitably accuratethermal image. But it can often be difficult to obtain a line of sightview of components that need to be thermally imaged.

IR imaging has been found particularly useful for analyzing heatdistribution of electrically charged components. For example, in thepreventative maintenance of high voltage electrical circuits andcomponents an IR image of the components can often reveal hot spotswhich may indicate malfunctioning, improperly connected, or overloadedcomponents. Timely identification of problem components can save onsystem downtime and expenses associated with replacing blown ordestroyed components. However, the location of such components may bedifficult to reach and may be located in hazardous, electricalenvironments, such as the interior of an electrical cabinet. In anotherapplication, an IR imaging device can be used as a bench tool for atechnician or engineer in the design and testing of printed circuitboards, integrated circuits, and other electronic device components.

SUMMARY

Certain embodiments of the invention relate to an infrared imaging probehaving a front-end assembly coupled to a distal end of the wand. Thefront-end assembly includes a lens, a focal plane array, and distalcircuitry. The lens is configured to receive image information in theform of infrared energy and direct the infrared energy onto the focalplane array. The distal circuitry is adapted to process signals from thefocal plane array and produce an output signal. Processing circuitry isconnected to and electrically isolated from the distal circuitry. Theprocessing circuitry provides an output connection that is connectableto one or more output/control devices. The processing circuitry isadapted to receive and process the output signal for transmission to theone or more output/control devices via the output connection.

Certain embodiments of the invention relate to an infrared imaging probesystem including a wand, one or more output devices, and an electricallyisolating connector. The wand includes a front-end assembly coupled to adistal end of the wand that is configured to receive image informationin the form of infrared energy and process the image information toproduce an output signal. The electrically isolating connector connectsthe front-end assembly to the one or more output devices.

Certain embodiments of the invention relate to a method of thermallyimaging components within an enclosed cabinet. The method includesproviding an infrared imaging system including a wand having a front-endassembly sized to fit through an access opening in the cabinet andcoupled to a distal end of the wand. The front-end assembly includes alens, a focal plane array, and distal circuitry. The wand furtherincludes processing circuitry connected to and electrically isolatedfrom the front-end assembly. The method also includes providing one ormore output devices connected to the infrared imaging system. Further,the method includes inserting the distal end of the wand through theaccess opening within the panel of the cabinet and maneuvering thedistal end of the wand to provide the lens a view of the components.

Certain embodiments of the invention relate to an infrared imaging probethat includes an elongate wand, an image collecting assembly, andprocessing circuitry. The image collecting assembly is coupled to adistal end of the wand and is configured to receive image information inthe form of infrared energy and process the image information to producean output signal. The processing circuitry is connected to andelectrically isolated from the image collecting assembly, and theprocessing circuitry is adapted to process the output signal for outputto one or more output devices.

BRIEF DESCRIPTION OF THE DRAWINGS

The following drawings are illustrative of particular embodiments of theinvention and therefore do not limit the scope of the invention. Thedrawings are not to scale (unless so stated) and are intended for use inconjunction with the explanations in the following detailed description.Embodiments of the invention will hereinafter be described inconjunction with the appended drawings, wherein like numerals denotelike elements.

FIG. 1 is a perspective view of an infrared imaging device connectedwith an output/control device, according to some embodiments of theinvention.

FIG. 2 is a component level block diagram of an infrared imaging deviceaccording to some embodiments of the invention.

FIG. 3 is a block diagram of an electrically isolating connectionaccording to some embodiments of the invention.

FIG. 4A is a side sectional view of an enclosure being imaged accordingto embodiments of the invention.

FIG. 4B is a side sectional view of an enclosure being imaged accordingto embodiments of the invention.

DETAILED DESCRIPTION OF THE DRAWINGS

For the purpose of promoting an understanding of the principles of theinvention, reference will now be made to the embodiments illustrated inthe drawing and specific language will be used to describe the same. Itwill, nevertheless, be understood that no limitation of the scope of theinvention is thereby intended; any alterations and further modificationsof the described or illustrated embodiments, and any furtherapplications of the principles of the invention as illustrated therein,are contemplated as would normally occur to one skilled in the art towhich the invention relates.

FIG. 1 shows a perspective view of an infrared imaging probe 100 (orthermal imaging device) according to an embodiment of the invention. Theinfrared imaging probe 100 provides an electrically isolated infraredcamera which can be especially useful for viewing hard-to-reach,hazardous areas, such as the interior of an electrical cabinet, or as abench tool for viewing small components at close range. In particular,the infrared imaging probe 100 includes a wand 102, a distal housing104, a lens 106, and an output connection 108 connectable to one or moreoutput/control devices 110. That is, the infrared imaging probe 100 maybe merely a thermal imaging probe that connects to one or more differentoutput/control devices 110. In addition, the infrared imaging probeincludes various electronics located within the distal housing 104 andconnected thereto as will be described with reference to FIG. 2.

Referring to the embodiment of FIG. 1, an infrared imaging probe 100according to the invention includes a front-end assembly 112 mounted atthe distal end of a wand 102. The front-end assembly 112 can include adistal housing 104 that houses the lens 106, focal plane array, anddistal circuitry of the infrared imaging probe 100. Lens 106 can beconfigured to receive image information from a targeted scene in theform of infrared energy and direct the infrared energy onto front-endimaging components within the distal housing 104. The wand enables auser to manipulate the distal housing 104 and lens 106 by gripping ahandle 114 or grip coupled to the proximal end of the wand 102. Therelatively small package size of the distal housing 104 and agilityprovided by the wand 102 allow the infrared imaging probe to be used toobtain thermal images from a target scene that may be otherwiseunreachable by the user with a traditional thermal imaging device. Anisolating connection 116, transmits collected scene image informationfrom the front-end assembly 112 to electrically isolated processingcircuitry which, in some embodiments, is housed within the handle 114.The processing circuitry processes and transmits the output signal toone or more output/control devices 110 via an output connection 108. Theoutput/control device 110 is used to display the image on a display 118and/or store in memory for future use.

In the embodiment of FIG. 1, the distal housing 104 is a generallycylindrical body fixedly coupled at the distal end of the wand 102. Thedistal housing 104 is generally rigid and in some embodiments and cancomprise and injection molded plastic. Further, some embodiments includean insulating layer lining the distal housing 104 to shield electronicsdisposed therein. For certain applications, the distal housing 104 mustbe maintained within certain package dimensions. For example, in oneembodiment, the diameter of a cylindrical distal housing 104 is lessthan 12 mm so that the infrared imaging probe can be used for inspectionof electrical cabinets having a 12 mm viewing port. Sizingconsiderations can further determine where to locate the infraredimaging probe 100 electronics (discussed below). Generally, the fewercomponents installed at the distal end of the wand 102, the smaller thenecessary distal housing 104 size. Moreover, while the distal housing104 of FIG. 1 is fixedly coupled with the wand 102, one shouldappreciate that other connections are within the scope of the invention.For example, some embodiments may include a hinged connection betweenthe distal housing 104 and wand 102 to allow for articulation of the tipof the infrared imaging probe 100.

Installed within the distal surface of the distal housing 104, the lens106 directs image information from the target scene onto the thermalimaging components therein. Lenses are well known in the art and anysuitable lens material, shape, and character of appropriate size can beused. In some embodiments, the lens 106 can be a fixed focus lens havinga standard field of view, a narrow field of view or a wide angle fieldof view. When the infrared imaging probe 100 is used as a bench tool,for example, for obtaining thermal images of a printed circuit board inoperation within a device, a close focus lens having a narrow field ofview may be preferred. Whereas a wide angle lens may be moreappropriate, for example, in preventative maintenance of high voltageelectronic devices kept within electrical cabinets. In otherembodiments, the lens 106 may have an adjustable focus and field ofview. Focus and field of view adjustments can be accomplished manuallyor automatically, and embodiments incorporating such features shouldinclude appropriate controls (electronic or otherwise) for accomplishingsuch adjustments.

The wand 102 is a generally elongate member that provides a fixed oradjustable separation distance between the proximal and distal ends ofthe infrared imaging probe 100. Suitable wands 102, according toembodiments of the invention, comprise a non-conductive material so thatthe infrared imaging probe 100 can be used to view electrically chargedcomponents such as, for example, in the inspection of high powerelectrical components within an enclosed cabinet. The wand 102 can berigid, semi-rigid, or flexible. A flexible wand, can be useful formanipulating the infrared imaging probe 100 into a shape appropriate foraccessing hard to reach target scenes. However, the wand 102 should besturdy enough to support the distal housing in the desired arrangement.Suitable wand materials can include, for example, carbon fiber,fiberglass, plastic, or other polymers. Other adjustable wandcharacteristics can be provided as well. For example, in someembodiments, the wand 102 can be a telescoping wand for adjusting thewand 102 length.

In some embodiments, an isolating connection 116 can extend along thelength of the wand 102 between the distal housing 104 and the infraredimaging probe's 100 processing circuitry. The type of isolatingconnection 116 used depends upon the on the electrically isolatingconnection between the front-end stages and the processing circuitry(see discussion below). For example, in embodiments where theelectrically isolating connection comprises an opto-electric connection,the isolating connection 116 could be a length of fiber optic cable. Insome embodiments, such as where the electrical isolation is accomplishedby wireless communication, the infrared imaging probe 100 may notinclude a separate isolating connection. While FIG. 1 shows theisolating connection 116 as being coupled to and alongside the wand 102,many other arrangements should be appreciated. For example, theisolating connection 116 need not be coupled with the wand 102 at all solong as the front-end assembly 112 communicates with the processingcircuitry. Alternatively, the wand 102 can be hollow having an interiorlumen along the wand 102 length through which the isolating connection116 can pass. Moreover, in some embodiments the wand 102 and isolatingconnection 116 can be combined, for example, the wand 102 could comprisea rigid fiber optic material for relaying an optical signal.

At the proximal end of the wand 102, some embodiments include a handle114. The handle 114 can provide a grip for the user such that theinfrared imaging probe 100 is easier to manipulate. In addition, thehandle 114 can house the infrared imaging probe's 100 processingcircuitry, controls, and/or other proximally located electronics.

Finally the infrared imaging probe 100 may include an output connection108 for operatively coupling the infrared imaging probe 100 to anoutput/control device 110. The output connection 108 can be anyconnection capable of transmitting the processed scene information anddata to the output/control device 110. Preferably, the output connection108 is a standard connection (e.g. USB, Firewire, or Ethernet) withrespective standard connectors on either end so that the infraredimaging probe 100 can be easily adapted for use with a variety ofoutput/control devices 110. In some embodiments, the output connection108 can be a wireless antenna for wirelessly connecting with anoutput/control device 110 via a wireless communication protocol.

With reference to FIG. 2, electronic components of the infrared imagingprobe 100 will now be discussed. Generally the infrared imaging probe100 can be described as having three stages: an optical stage 200, adistal stage 202 and a processing stage 204. In some embodimentsaccording to the invention, the optical stage 200 and distal stage 202(collectively referred to here as the “front end stages 206”) reside inthe distal housing 104 of the infrared imaging probe 100, and areconnected with the processing stage 204 by an electrically isolatingconnection 116. In most embodiments, the processing stage 204 does notreside at the distal end of the wand 102. Instead, the processing stage204 can be coupled with the proximal end of the wand 102, for example inthe handle 114. Alternatively, in some embodiments, the non-distallylocated processing stage 204, is located within a separate housing thatis not coupled to the wand. The output connection 108 provides forconnection from the processing stage 204, wherever located, to anoutput/control device 110. In another aspect of the invention, theinfrared imaging probe 100 does not include a processing stage 204,rather, the functionality of the processing stage 204 (and in someembodiments, at least a portion of the functionality of the distal stage202) is incorporated into the output/control device 110.

In operation, the infrared imaging probe 100 receives image informationin the form of infrared energy through the lens 106, and in turn, thelens 106 directs the infrared energy onto the focal plane array (FPA)226. The combined functioning of the lens 106 and FPA 226 enablesfurther electronics within the infrared imaging probe 100 to create animage based on the image view captured by the lens 106, as describedbelow.

The FPA 226 can include a plurality of infrared detector elements (notshown), e.g., including bolometers, photon detectors, or other suitableinfrared detectors well known in the art, arranged in a grid pattern(e.g., an array of detector elements arranged in horizontal rows andvertical columns). The size of the array can be provided as desired andappropriate given the desire or need to limit the size of the distalhousing to provide access to tight or enclosed areas. For example, manyembodiments have an array of 50×50 detector elements, but the inventionshould not be limited to such. In fact, for certain applications, anarray as small a single detector (i.e. a 1×1 array) may be appropriate.(It should be noted a infrared imaging probe 100 including a singledetector, should be considered within the scope of the terms “imagingprobe” and “imager” as they are used throughout this application, eventhough such a device may not be used to create an “image”).Alternatively, some embodiments can incorporate very large arrays ofdetectors. In some embodiments involving bolometers as the infrareddetector elements, each detector element is adapted to absorb heatenergy from the scene of interest (focused upon by the lens 106) in theform of infrared radiation, resulting in a corresponding change in itstemperature, which results in a corresponding change in its resistance.With each detector element functioning as a pixel, a two-dimensionalimage or picture representation of the infrared radiation can be furthergenerated by translating the changes in resistance of each detectorelement into a time-multiplexed electrical signal that can be processedfor visualization on a display or storage in memory (e.g., of acomputer). Further circuitry downstream from the FPA 226, as isdescribed below, is used to perform this translation. Incorporated onthe FPA 226 is a Read Out Integrated Circuit (ROIC), which is used tooutput signals corresponding to each of the pixels. Such ROIC iscommonly fabricated as an integrated circuit on a silicon substrate. Theplurality of detector elements may be fabricated on top of the ROIC,wherein their combination provides for the FPA 226. In some embodiments,the ROIC can include components discussed elsewhere in this disclosure(e.g. an analog-to-digital converter (ADC) 230) incorporated directlyonto the FPA circuitry. Such integration of the ROIC, or other furtherlevels of integration not explicitly discussed, should be consideredwithin the scope of this disclosure.

As described above, the FPA 226 generates a series of electrical signalscorresponding to the infrared radiation received by each infrareddetector element to represent a thermal image. A “frame” of thermalimage data is generated when the voltage signal from each infrareddetector element is obtained by scanning all of the rows that make upthe FPA 226. Again, in certain embodiments involving bolometers as theinfrared detector elements, such scanning is done by switching acorresponding detector element into the system circuit and applying abias voltage across such switched-in element. Successive frames ofthermal image data are generated by repeatedly scanning the rows of theFPA 226, with such frames being produced at a rate sufficient togenerate a video representation (e.g. 30 Hz, or 60 Hz) of the thermalimage data.

In some embodiments, optical stage components can further include ashutter 208. A shutter 208 can be externally 210 or internally 212located relative to the lens 106 and operate to open or close the viewprovided by the lens 106. As is known in the art, the shutter 208 can bemechanically positionable, or can be actuated by an electro-mechanicaldevice such as a DC motor or solenoid. Embodiments of the invention mayinclude a calibration or setup software implemented method or settingwhich utilize the shutter 208 to establish appropriate bias (e.g. seediscussion below) levels for each detector element.

The distal stage 202 includes circuitry (distal circuitry) forinterfacing with and controlling the optical stage 200. In addition, thedistal stage 202 circuitry initially processes and transmits collectedinfrared image data to the processing stage 204. More specifically, thesignals generated by the FPA 226 are initially conditioned by the distalstage 202 circuitry of the infrared imaging probe 100. In certainembodiments, as shown, the distal stage 202 circuitry includes a biasgenerator 220 and a pre-amp/integrator 222. In addition to providing thedetector bias, the bias generator 220 can optionally add or subtract anaverage bias current from the total current generated for eachswitched-in detector element. The average bias current can be changed inorder (i) to compensate for deviations to the entire array ofresistances of the detector elements resulting from changes in ambienttemperatures inside the infrared imaging probe 100 and (ii) tocompensate for array-to-array variations in the average detectorelements of the FPA 226. Such bias compensation can be automaticallycontrolled by the infrared imaging probe 100 or software, or can be usercontrolled via input to the output/control device 110 or processingstage 204. Following provision of the detector bias and optionalsubtraction or addition of the average bias current, the signals can bepassed through a pre-amp/integrator 222. Typically, thepre-amp/integrator 222 is used to condition incoming signals, e.g.,prior to their digitization. As a result, the incoming signals can beadjusted to a form that enables more effective interpretation of thesignals, and in turn, can lead to more effective resolution of thecreated image. Subsequently, the conditioned signals are sent downstreaminto the processing stage 204 of the infrared imaging probe 100.

In some embodiments, the distal stage 202 circuitry can include one ormore additional elements for example, additional sensors 224 or an ADC230. Additional sensors 224 can include, for example, temperaturesensors, visual light sensors (such as a CCD), pressure sensors,magnetic sensors, etc. Such sensors can provide additional calibrationand detection information to enhance the functionality of the infraredimaging probe 100. For example, temperature sensors can provide anambient temperature reading near the FPA 226 to assist in radiometrycalculations. A magnetic sensor, such as a Hall effect sensor, can beused in combination with a magnet mounted on the lens to provide lensfocus position information. Such information can be useful forcalculating distances, or determining a parallax offset for use withvisual light scene data gathered from a visual light sensor.

An ADC 230 can provide the same function and operate in substantiallythe same manner as discussed below, however its inclusion in the distalstage 202 may provide certain benefits, for example, digitization ofscene and other sensor information prior to transmittal via theelectrically isolating connection 116. In some embodiments, the ADC 230can be integrated into the ROIC, as discussed above, thereby eliminatingthe need for a separately mounted and installed ADC 230.

Because of the electrical isolation of the distal circuitry (discussedbelow), some embodiments include a separate power supply for thefront-end stages 206. For example, a battery can be installed within thefront-end assembly 112 to power the distal circuitry, FPA 226 and otherdistal components.

As discussed above, the front end stages 206 are generally locatedwithin the distal housing 104 of the infrared imaging probe 100.Embodiments according to the invention include an electrically isolatingconnection 116 between the front end stages 206 and the processing stage204. The isolating connection 116 in combination with a non-conductivewand allows for the gathering of scene data without providing aconductive path between the distal wand end and the user who typicallygrips the infrared imaging probe 100 at the proximal end of the wand.Thus, the infrared imaging probe 100 can be used to view electricallyactive components with significantly reduced risk of electrical shock tothe user.

The electrical isolation can be accomplished by various methods. Forexample, with reference to the isolation schematic of FIG. 3, anelectrically isolating connection 116 can generally include twotransducers 300 coupled by a non-electrically conductive communicationmedium 302 (generally corresponding to the isolating connection 116 ofFIG. 1). In certain embodiments, the transducers 300 are opto-electricaltransducers, translating electrical signals into optical pulses and viceversa. With such transducers, a fiber optic connection medium can beused to transfer optical signals generated by one transducer 300 to theother transducer 300, and vice versa. Alternatively, in someembodiments, the non-electrically conductive communication medium 302can be an electromagnetic wave transmissible medium such as, forexample, air. In such an example, the transducers 300 can be in wirelesscommunication with each other. In such case, the transducers 300 caninclude wireless antennas, and any number of wireless communicationprotocols may be used, for example, Bluetooth or WiFi.

In the schematic of FIG. 2, the electrically isolating connection 116 isrepresented as being separate from the distal stage 202. However, itshould be understood that components of the electrically isolatingconnection 116, such as a transducer 300, can be integrated into distalstage 202. Likewise, a transducer 300 on the proximal end of theelectrically isolating connection 116 can be integrated with theprocessing stage 204 or can be a separate component.

Generally, the processing stage 204, can include one or more of afield-programmable gate array (FPGA) 228, a complex programmable logicdevice (CPLD) controller and a processor 214 (e.g., computer processingunit (CPU) or digital signal processor (DSP)). These elements manipulatethe conditioned scene image data delivered from the front end stages 206in order to provide output scene data that can be displayed or storedfor use by the user. Subsequently, the processing stage 204 circuitry(processing circuitry) sends the processed data to the output/controldevice 110.

In addition to providing needed processing for infrared imagery, theprocessing stage 204 circuitry can be employed for a wide variety ofadditional functions. For example, in some embodiments, the processor214 can perform temperature calculation/conversion (radiometry), combinescene information with data and/or imagery from other sensors, orcompress and translate the image data. Additionally, in someembodiments, the processor 214 can interpret and execute commands fromthe output/control device 110. This can involve processing of variousinput signals and transferring those signals via the electricallyisolating connection 116 to the front end stages 206 where components atthe front end (e.g. motors, or solenoids) can be actuated to accomplishthe desired control function. Exemplary control functions can includeadjusting the focus, opening/closing a shutter, triggering sensorreadings, adjusting bias values, etc. Moreover, input signals may beused to alter the processing of the image data that occurs at theprocessing stage 204.

The processing stage 204 circuitry can further include other components216 to assist with the processing and control of the infrared imagingprobe 100. For example, as discussed above, in some embodiments, an ADC230 can be incorporated into the processing stage 204. In such a case,analog signals conditioned by the front-end stages 206 are not digitizeduntil reaching the processing stage 204. Moreover, some embodiments caninclude additional on board memory for storage of processing commandinformation and scene data, prior to transmission to the output/controldevice 110. In addition, some embodiments may include one or morecontrols for controlling device functionality independent of theoutput/control device 110. For example, the infrared imaging probe 100may include a knob or buttons installed in the handle for adjusting thefocus or triggering the shutter.

As described above, the output connection 108 is preferably a standardconnection such as USB, Firewire, or Ethernet. The general operation ofthe output connection 108 resembles that of the insulating connection116 shown in FIG. 3, i.e. a pair of transducers 300 coupled via atransmission medium 302. It should be noted that because the outputconnection 108 resides between components electrically isolated from thepotentially hazardous target scene, it is not necessary to provide anon-conductive connection medium as described above. This not to saythat non-conductive connection media 302 (such as those described above)cannot be used, but merely that standard connectors, which are typicallyconductive, can be used. Moreover, the processing stage 204 circuitryneed not be directly connected to the output/control device 110 asshown. For example, in some embodiments, the infrared imaging probe 100includes a connection to an intermediate network or system, for example,the Internet or a LAN. Communication protocols of the intermediatesystem can be used to provide data transfer between the infrared imagingprobe 100 and one or more output/control devices 110 similarly connectedto the intermediate system.

The output/control device 110 to which the infrared imaging probe 100 isconnected can include any number of devices. For example, theoutput/control device 110 can include one or more of a digitalmultimeter, a personal computer, a personal digital assistant, a displaydevice, and a cellular phone. Typical output/control devices 110 includea display capable of displaying the image generated from the scene datacollected by the infrared imaging probe 100. Some output/control devices110 may further include one or more input interfaces such as buttons, ora graphical user interface to allow the user to control or alter theoperation of the infrared imaging probe 100.

In another aspect of the invention, the infrared imaging probe 100(shown in FIG. 1) does not include a processing stage 204. Rather, thefunctionality of the processing stage 204 (and in some embodiments, atleast a portion of the functionality of the distal stage 202) isincorporated into the output/control device 110. In this aspect, theelectrically isolating connection 116 can connect directly to anoutput/control device 110. The functionality of the front-end (generallythe analog control of the optical stage) remains with the distal stage202 circuitry, but the output signal from the distal stage 202 circuitryarrives at the output/control device 110 un-processed. In suchembodiments, the output/control device 110 can include an optical input,for example, to receive the electrically isolating connection 116.Further, the output/control device 110 can include software instructionsor additional hardware to accomplish the processing for which theprocessing stage was responsible in the above described embodiments. Insome embodiments, the output/control device 110 is equipped to processanalog data sent from the distal stage 202 circuitry, while in otherembodiments, the distal stage 202 circuitry includes an ADC 230 (asdiscussed above) to provide a digital signal to the output/controldevice 110.

As shown in FIGS. 4A and 4B, infrared imaging probes 100 according toembodiments of the invention can be used in the field of preventativemaintenance of electrical equipment. Here, electricalequipment/components 218 within a closed enclosure 400 can be viewedwithout requiring the enclosure 400 to be opened, or the electricalequipment/components 218 within to be powered down. In each exemplaryuse shown, the distal housing 104 of the infrared imaging probe 100 hasbeen inserted into the enclosure 400 through an access opening 402within a panel 404 of the enclosure 400. The access opening 402 can beany aperture through the panel sized large enough to receive the distalhousing 104. In some embodiments, the access opening 402 can be a portalinstalled within the panel 404 designed to meet safety standardsregarding electrical enclosures, such as those provided by the NationalElectrical Manufacturers Association (NEMA). A user positioned outsideof the enclosure can grip the infrared imaging probe 100 by its handle114 and maneuver the distal end to provide the desired view which can bedisplayed or stored on the connected output/control device 110. In sucha use, the desire to electrically isolate the distal end of the wand 102becomes apparent. The electrically isolating connection 116 andnon-conductive wand 102 (both described above) prevent the formation ofa conductive path from the distal housing 104 through the user grippingthe infrared imaging probe 100 to ground. Thus, the risk of arcing canbe avoided.

In FIG. 4A, an infrared imaging probe 100 having a generally straight,rigid wand 102 is used to inspect operating electricalequipment/components 218. The infrared imaging probe 100 can be insertedstraight (indicated as Position I) into the enclosure 400 to viewelectrical equipment/components 218 directly aligned with the accessopening 402. To view electrical equipment/components 218 in the bottomof the enclosure 400, the handle 114 of the infrared imaging probe 100can be pivoted upward (e.g. to Position II). Likewise, the user canpivot the handle 114 of the infrared imaging probe 100 downward (e.g. toPosition III) to view electrical equipment/components 218 in the top ofthe enclosure 400. Moreover, the infrared imaging probe 100 can bepivoted side-to-side to view electrical equipment/components 218 outsideof the horizontal field of view of the infrared imaging probe 100.

In FIG. 4B, an infrared imaging probe 100 having a bendable, orarticulatable wand 102 has been inserted through the access opening 402.In Position I, the wand 102 has been bent such that the distal housing104 can maneuver around an obstacle 406 within the enclosure 400 to viewelectrical equipment/components 218 that would otherwise be hidden fromline of sight view. In an alternative position (e.g. Position II), abendable wand 102 can be used to obtain other hard to reach views, suchas the inner surface of the panel 404 in which the access opening 402 isinstalled.

In another example, a infrared imaging probe 100 according toembodiments of the invention can be used as a bench tool alongside forexample, a signal generator, multimeter, and other electronic analysisand design tools. An engineer, technician, tester, or designer ofelectronic devices can use a thermal imaging wand according to theinvention to thermally analyze components at their workbench.Specifically, in some applications such as, for example, consumerelectronics, design constraints may require circuit boards andelectronic components to be installed in small, tight packages.Embodiments of the invention can be positioned relative to such packagesso as to obtain a proper contextual frame for analysis of the thermalprofile of the device, or a portion thereof.

While the invention has been described in conjunction with specificembodiments thereof, it is evident that many alternatives,modifications, and variations will be apparent to those skilled in theart in light of the foregoing description. Accordingly, it is intendedto embrace all such alternatives, modifications, and variations, whichfall within the spirit and broad scope of the invention or as set forthin the appended claims.

What is claimed is:
 1. A method of thermally imaging components withinan enclosed cabinet, comprising: providing (i) an infrared imagingsystem comprising a wand having a front-end assembly sized to fitthrough an access opening within a panel of the cabinet and coupled to adistal end of the wand, the front-end assembly including a lens, a focalplane array, and distal circuitry, the wand further including processingcircuitry connected to and electrically isolated from the front-endassembly, and (ii) one or more output devices connected to the infraredimaging system; inserting the distal end of the wand through the accessopening; and maneuvering the distal end of the wand to provide the lensa view of the components.
 2. The method of claim 1, wherein the one ormore output devices comprise one or more of a digital multimeter, apersonal computer, a personal digital assistant, a display device, and acellular phone.
 3. The method of claim 1, wherein the access opening isapproximately 12 mm in diameter.
 4. The method of claim 1, wherein theprocessing circuitry is located proximate to a proximate end of thewand.